Indium Corporation [1]’s Dr. Ron Lasky [2], Senior Technologist, will
host an Avoid the Void® workshop on how to avoid voiding in bottom
terminated components (BTCs) on Thursday, June 11 at 9 a.m. and 2 p.m.
EST on Indium Corporation’s webinar program, the InSIDER Series.
BTCs are one of the most common packages in electronics today with the
highest growth rate due to their small size, excellent electrical
performance, and ability to transfer heat away from the integrated
circuit (IC). In his workshop, _Understand and Troubleshoot Voiding in
Bottom Terminated Components_, Dr. Lasky will discuss how voids form in
QFNs and how to minimize them. He’ll also cover factors that affect
voiding, such as stencil design, stencil thickness, reflow profile,
solder paste particle size, and solder pastes. The use of solder
preforms to minimize voiding will also be presented.
Dr. Lasky’s workshop is offered as part of Indium Corporation’s free
webinar program, the InSIDER Series. Register for his workshop here [3].
All of Indium Corporations webinars can be found at
http://www.indium.com/webinar [4].
Dr. Lasky is a Senior Technologist at Indium Corporation, as well as a
Professor of Engineering and the Director of the Lean Six Sigma program
at Dartmouth College. He has more than 30 years of experience in
electronics and optoelectronics packaging at IBM, Universal Instruments,
and Cookson Electronics. Dr. Lasky has authored six books, and
contributed to nine more, on science, electronics, and optoelectronics,
and has authored numerous technical papers. Additionally, he has served
as an adjunct professor at several colleges, teaching more than 20
different courses on topics ranging from electronics packaging,
materials science, physics, mechanical engineering and science, and
religion. Dr. Lasky holds numerous patent disclosures and is the
developer of several SMT processing software products relating to cost
estimating, line balancing, and process optimization. He is the
co-creator of engineering certification exams that set standards in the
electronics assembly industry worldwide. Dr. Lasky was awarded the
Surface Mount Technology Association’s Founder’s Award in 2003. Dr.
Lasky holds four degrees, including a Ph.D. from Cornell University in
materials science, and is a licensed professional engineer.
Indium Corporation is a premier materials manufacturer and supplier to
the global electronics, semiconductor, thin-film, and thermal management
markets. Products include solders and fluxes; brazes; thermal interface
materials; sputtering targets; indium, gallium, germanium, and tin
metals and inorganic compounds; and NanoFoil®. Founded in 1934, the
company has global technical support and factories located in China,
India, Malaysia, Singapore, South Korea, the United Kingdom, and the
USA.
For more information about Indium Corporation, visit www.indium.com [5]
or email jhuang@indium.com. You can also follow our experts, From One
Engineer To Another® (#FOETA), at www.facebook.com/indium [6] or
@IndiumCorp [7
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