The new underfill adhesive is reworkable despite its black colour. The new Structalit 5751 adhesive developed by Panacol allows manufacturers to reduce both manufacturing costs and environmental impact by reusing electronic components mounted on PCBs. To reduce stress between the chip and substrates, chips are attached directly to the interconnection points without any intermediate elements. […]
The post Reuse Electronic Components with New Underfill Adhesive appeared first on Electronics For You.
No comments:
Post a Comment